GLOBAL PACKAGING FORUM ” PACKAGED TO PERFECTION”

Global Packaging Forum – “Packaged to Perfection”

The Global Packaging Forum, themed “Packaged to Perfection”, will take place during WPO Week, coinciding with the arrival of WPO members in Sri Lanka for the 114th Board Meeting.

Hosted by the Sri Lanka Institute of Packaging (SLIP), as part of the WPO Board Meeting series of events, this forum will serve as a premier platform for dialogue and collaboration in the global packaging industry.

The program will feature an impressive line-up of international thought leaders and distinguished local industry experts, who will share insights on emerging trends, innovative solutions, and future directions in packaging.